Capabilities
- Up to 34 Layers
- Board Size to 22” x 27.5”
- Maximum panel size: 24” x 28”
- Board Thickness to .250”
- Heavy Copper: 12oz / 6oz (Inner/Outer)
- Sequential Lamination Construction
- Buried/Blind via (Stacked Blind Vias)
- Minimum Line Space: 2/2 Mil (Inner & Outer Layer)
- 16:1 Plating Aspect Ratio (PCB Thickness/Finish Hole Size)
- Minimum Finish Hole Size .004” (both mechanical & laser drills)
- 4 Build Up HDI (Laser Vias)
- Aluminum Base Plate Heat Sink PCB
- Thin core as low as .002”
- Warpage: .005”/inch
- Controlled impedance
-
Surface finishes available:
- HASL
- ENIG
- ENEPIG
- Selective Gold Plating
- Immersion Silver
- OSP
- Carbon
- Immersion Tin
- Selective heavy Au
- HASL (Lead free)
- Wire Bonding Soft Gold
- Hard Gold
Materials
- FR4 Tg140°C
- FR4 Tg150°C
- FR4 Tg180°C
- IT-200LK Tg200°C
- Rogers RO4350 Core
- Halogen Free
- Other materials upon request
Plating Proccesses
- Hard Gold
- Electroless Nickel/ Immersion Gold (ENIG)
- Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG)
- Lead Free HASL
-
Other plating processes upon demand:
- (HASL) Hot Air Solder Leveling
- Organic Solderability Preservative (OSP)
- Wire Bonding Soft Gold
- Selective Gold
- Immersion Silver
- Immersion Tin
Manufacturing
- DFM
- Pre-Production Quantities
- Production Runs
- Heavy Copper Specialists
- HDI
- Backplane
- ATE Boards
- Metal Core Products
Equipment List
-
Tooling Design
- GC-CAM, Gensis 2000, InCAM, ParCAM
- A/W Laser Plotters
- AOI
- A/W Inspection Machine
- A/W Developing Machine
- 2D Measuring Instrument
- Polar CITS25
-
Inner Layer Processing
- Auto Diamond Saw Cutting Machine
- Auto D/F Laminate Line
- Auto Roller Coating Line
- Auto UV Exposure Machine
- LASER Direct Image
- Thin core pre-treatment lines
- Thin core Dev/Etch/Strip lines
- Heavy copper etching line
- CCD Automatic Tooling Hole Drilling Machines
- AOI & VRS
-
Lamination
- CCD Tooling Hole Punch Machine
- CCD Auto tooling Hole Drilling Machine
- Automatic Black Oxide Line
- Automatic Horizontal Co-bra bond line
- Prepreg bonding machine
- Vacuum lamination press (4H, 2C)
- Metal & Plastic eyelet machines
- CNC routing machines
- X-ray targeting & drilling machines
- Auto Loading/unloading & conveying for Lamination
- Auto X-ray Target Measuring and Drilling Machine
-
Drilling
- Edge Beveling Machines
- CNC drilling machines (138 spindles)
- Laser drilling machines (2 x 2 spindles)
- Hole counter
-
Outer Layer Processing
- Auto Deburr Line
- Plasma Appl AU-16H
- Desmear & plated thru hole line
- 1st copper plating (panel) line
- Vertical copper plating (panel) line
- High aspect ratio vertical copper plating (panel) line
- Copper filled BVH plating line
- Automatic dry film laminators
- Auto & semi-auto UV exposure machines
- Dry film developing lines
- Dry film/Etching/Stripping lines
- 2nd Copper plating (pattern) line
- Dry film stripping/etching/tin stripping
- Belt sander & automatic epoxy scrubbing line
- AOI & VRS
-
Soldermask
- Scrubbing & cleaning machines
- Pumice treatment line
- Semi-auto printing machines
- Solder mask Pre-cure line
- Automatic UV exposure machines (4 CCD alignment)
- Semi-auto UV exposure machines
- Solder mask developing machines
- Post cure lines
- Vacuum Resin Plugging Machine
-
Legend
- CCD automatic printing lines
- Semi-auto printing machines
- Automatic Curing Line
-
Carbon Ink
- CCD automatic carbon ink printing lines
- Automatic curing lines
-
Routing
- CNC routing machines (54 spindles)
- Beveling machine
- Scoring machines
- Final cleaning with Ultrasonic wave
- Hole Counter
-
Electrical Testing
- Universal testers (LMx2, CLx4)
- Moving probe testers
- Semi-auto dedicate testers
- Automatic dedicate testers
-
Final Inspection
- Automatic optical cosmetic inspection
-
Package
- Vacuum packaging machines